以600mm×600mm面板为例，其面积是12英寸晶圆载板的5.1倍，单片产出芯片数量大幅增加。同时，FOPLP的面积利用率超95%，显著优于传统晶圆级封装的85%，同等面积下面板可多容纳1.64倍芯片。基板面积增大持续降低成本，200mm向300mm过渡节约25%成本，300mm向板级封装过渡更可节约66%成本。
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Fortunately, the best parts have been retained, too. Samsung has unified the design style across the entire S26 series, with the same corner ratios, curved edges and other design touches. While I tested both phones, I’ll focus on the S26. Barring screen differences and battery size, they’re identically specced.
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